Cooling system for air flow free acceleration insensitive electronic chip or processor

摘要

The chip and/or processor [6] is on a circuit board [7] is held against an adapter plate [5] with a heat conducting foil in between [10]. The adapter is on a spacer [11] that connects with the heat sink wall [1] that has heat dissipating fins [2]. The adapter connects by a heat pipe [3] to the heat sink wall.