Arrangement with bearer substrate, semiconducting integrated circuit component has component(s) with contact elements connected to connection side of IC component facing substrate

摘要

The arrangement has a bearer substrate with contact surfaces and a semiconducting integrated circuit component with contact surfaces on the side facing the substrate in direct contact with the contact surfaces. At least one semiconducting component has second contact elements with which it is connected to the connection side of the semiconducting integrated circuit component facing the substrate. The arrangement has a bearer substrate (1) with contact surfaces (7) and a semiconducting integrated circuit component (2) with contact surfaces on the side facing the substrate in direct contact with the contact surfaces on the substrate. At least one semiconducting component (3) has second contact elements protruding from the side facing the semiconducting integrated circuit component with which it is connected to the connection side of the semiconducting integrated circuit component facing the substrate. AN Independent claim is also included for the following: a method manufacturing an inventive arrangement.