| 摘要 |
A palladium removing solution, characterized in that it comprises (a) a salt of nitric acid, (b) an agent making palladium oxides soluble in water and (c) water. The palladium removing solution may further comprises (d) a wetting solution and/or (e) a chelating agent. The palladium removing solution can be used for removing the palladium remaining on the surface of an insulating substrate and thereby improving the insulating performance of a circuit pattern, without eroding a copper wiring or roughening the surface of the insulating substrate.
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