发明名称 Barrier layer for electrical connectors and methods of applying the layer
摘要 A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, wherein the barrier layer is selected from the group consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, and rhodium
申请公布号 US2003035977(A1) 申请公布日期 2003.02.20
申请号 US20010015500 申请日期 2001.12.11
申请人 DATTA AMIT 发明人 DATTA AMIT
分类号 B32B15/04;B32B15/20;C23C28/00;C23C28/02;C25D3/00;C25D3/12;C25D3/56;C25D5/10;C25D5/34;C25D7/00;H01L;H01R13/03;(IPC1-7):C25D7/00 主分类号 B32B15/04
代理机构 代理人
主权项
地址