发明名称 Construction of a heat sink for electronics cooling is formed of parallel metal plates in a holder
摘要 <p>The heat energy generating chip [21] is located on a circuit board [2] and placed over it is a thermally dissipating heat sink [1]. Air flow is forced over the heat sink by an electrical fan [3]. The heat sink has a number of metal plates [12] in a retainer [11] that maintain a gap between adjacent plates for air to pass.</p>
申请公布号 DE20218872(U1) 申请公布日期 2003.02.20
申请号 DE2002218872U 申请日期 2002.12.05
申请人 KWO GER METAL TECHNOLOGY, INC. 发明人
分类号 H01L23/367;H01L23/467;(IPC1-7):G06F1/20 主分类号 H01L23/367
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