发明名称 |
Construction of a heat sink for electronics cooling is formed of parallel metal plates in a holder |
摘要 |
<p>The heat energy generating chip [21] is located on a circuit board [2] and placed over it is a thermally dissipating heat sink [1]. Air flow is forced over the heat sink by an electrical fan [3]. The heat sink has a number of metal plates [12] in a retainer [11] that maintain a gap between adjacent plates for air to pass.</p> |
申请公布号 |
DE20218872(U1) |
申请公布日期 |
2003.02.20 |
申请号 |
DE2002218872U |
申请日期 |
2002.12.05 |
申请人 |
KWO GER METAL TECHNOLOGY, INC. |
发明人 |
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分类号 |
H01L23/367;H01L23/467;(IPC1-7):G06F1/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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