BAKE APPARATUS OF SEMICONDUCTOR FABRICATION EQUIPMENT

摘要

PURPOSE: A bake apparatus of semiconductor fabrication equipment is provided to set a wafer on a proper position of a hot plate by using a guide sensor. CONSTITUTION: A process chamber(100) is used for performing a bake process. A hot plate(110) is installed within the process chamber(100) in order to perform the bake process by heating a wafer(130). A plurality of support pins(120) are installed on the hot plate(110) in order to load or unload the wafer(130) on the hot plate(110). A plurality of guide sensors(140) are installed on the hot plate(110) in order to guide the wafer(130) to a proper position. The guide sensors(140) are used as optical sensors. An insulating body(150) is installed on a contact portion between the hot plate(110) and the guide sensors(140) in order to protect the guide sensors(140) from the heat.