发明名称 Heat-relaxable substrates and arrays
摘要 Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.
申请公布号 US2003036090(A1) 申请公布日期 2003.02.20
申请号 US20020263619 申请日期 2002.10.03
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 PATIL SANJAY L.;DUAN DANIEL C.;HALVERSON KURT J.;LEPERE PIERRE H.
分类号 G01N31/22;B01J19/00;B01J19/12;B29C35/02;B29C35/08;B29C61/02;B29C61/06;C12M1/00;C12M1/38;C12N15/09;C40B40/06;C40B60/14;G01N33/53;G01N33/566;G01N37/00;(IPC1-7):C12Q1/68;B05D3/00 主分类号 G01N31/22
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