发明名称 |
METHOD FOR FABRICATING LARGE AREA FLEXIBLE ELECTRONICS |
摘要 |
A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices andelements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the originalsemiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate haspreliminarily made receptors in a form of a truncated cone and the devices and circuitsfill these receptors. Both the receptors and the devices and circuits have metallizationcontacts enabling to establish electrical contact between them. A method for real-timemonitoring and verification of correctness of placement of the devices and circuits into thereceptors by applying voltage pulse waveforms and measuring the resulting current pulse. |
申请公布号 |
WO03015490(A2) |
申请公布日期 |
2003.02.20 |
申请号 |
WO2002US24982 |
申请日期 |
2002.08.06 |
申请人 |
HRL LABORATORIES, LLC;SAYYAH, KEYVAN |
发明人 |
SAYYAH, KEYVAN |
分类号 |
H01L21/00;H01L21/673;H01L21/98;H05K1/00;H05K3/20 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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