发明名称 WELDED LEADFRAME
摘要 <p>In joining a lead of a leadframe (3) or component to a contact pad (9) of a substrate (1), the lead and contact pad are locally welded to be electrically connected. For reducing the power used in the welding operation the lead has at least one hole and preferably two holes (11), the material of the lead thereby melting, in the welding step, at the edges of holes to be joined with the heated material of the pad. Thereby a relatively low power can be used in the welding, the local heating used in the welding melting preferably or primarily material in the walls of said at least one hole.</p>
申请公布号 WO2003015485(A1) 申请公布日期 2003.02.20
申请号 SE2002001434 申请日期 2002.08.07
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