| 摘要 |
A semiconductor module (1) is proposed whose semiconductor chips are arranged on a base/intermediate plate (3), having an insulating frame (6), a ceramic plate (8), which is arranged between the base/intermediate plate and a cooler (5) provided for the mounting of the semiconductor module, the insulating frame (6) enclosing the semi-conductor module and being designed for the fixing thereof on the cooler (5) and also having at least the structural height of the semiconductor module, and there being a potential connection (14, 15) between gate and/or emitter (2, 21) of the semiconductor module (1), on the one hand, and the base/intermediate plate (3), on the other hand. |
