COPPER ON INVAR COMPOSITE AND METHOD OF MAKING

摘要

A composite for use if forming a multi-layer printed circuit board, comprised of an INVAR sheet (12) having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper (72) on at least one side thereof. The copper has a thickness of between 1 mu and 50 mu , wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0 DEG F and 200 DEG F.