| 摘要 |
<p>An apparatus for holding and orienting a wafer (4) includes a movable robot arm (6), and an end effector (8) attached to an end of the robot arm (6), the end effector (8) including a gripping mechanism (12a-f) which during operation holds and rotates the wafer (4) about an axis that is perpendicular to the plane of the wafer (4), wherein the gripping mechanism (12a-f) comprises a first contacting member, and a second contacting member, and a drive member (12e, f) arranged to grip opposing edges of the wafer (4), and wherein the drive member (12a, f) comprises a first pair of rollers.</p> |
