STACKED THIN SMALL OUTLINE PACKAGE

摘要

PURPOSE: A stacked thin small outline package is provided to simplify a fabrication process of a connection pin by stacking a plurality of thin small outline packages having compatible chip selection pins and compatible dummy pins. CONSTITUTION: A stacked thin small outline package(300) is formed by stacking vertically a plurality of thin small outline packages. The thin small outline package has a couple of package bodies(315,325) including a couple of semiconductor chips(311,321) and a plurality of connection pins projected from the package bodies(315,325). The connection pins are electrically connected with bonding pads(314,324) of the semiconductor chips(311,321) through wires(313,323). A chip selection pin(319) corresponds to a dummy pin(328). The stacked thin small outline package(300) is formed with a thin small outline package(310) and one ore more stacked thin small outline packages(320).