RESIN COMPOSITION,COMPOSITION FOR SOLDER RESIST,AND CURED ARTICLE OBTAINED THEREFROM

摘要

A resin composition which is excellent in photosensitivity and developability, gives a cured article excellent in flexibility, soldering heat resistance, resistance to thermal deterioration, and resistance to electroless gold plating, and is suitable especially for use in forming solder resists and interlayer dielectrics. The resin composition is characterized by containing an oligomer (A) obtained by reacting the following ingredients (a) to (d): an epoxy resin having at least two epoxy groups per molecule, a compound having two hydroxy groups and one carboxy group per molecule, a carboxylated rubbery polymer, and a monobasic acid having an unsaturated group.