发明名称 Stencil for screen printing of circuit board components, made of paper and affixed to rigid frame or tensioned on frame
摘要 <p>Stencil (4) is made of paper which does not tear easily, is dimensionally stable, free of fluff and lint, absorbs little liquid, and is resistant to solder and paste. Stencil is affixed to rigid, aluminum or steel frame (4) or is clamped to tensioning frame by holes around stencil edge which take up pins of frame. Paper thickness is 40 Microm to 500 Microm, preferably between 50 Microm to 250 Microm.</p>
申请公布号 DE20215298(U1) 申请公布日期 2003.02.20
申请号 DE2002215298U 申请日期 2002.10.04
申请人 CADILAC LASER GMBH CAD INDUSTRIAL LASERCUTTING 发明人
分类号 B41N1/24;H05K3/12;(IPC1-7):B41N1/12;H05K13/04 主分类号 B41N1/24
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