METHOD FOR WAFER BACK GRINDING AND WAFER MOUNTING APPARATUS

摘要

PURPOSE: A method for wafer back grinding and wafer mounting apparatus are provided to prevent a handling error and a breaking phenomenon of a wafer by removing the generation of wafer warpage in a wafer back grinding process. CONSTITUTION: An active region of a wafer(10) formed with ICs is adhered on a cover tape(12) adhered on a wafer ring(14). An ultraviolet tape is used as the cover tape(12). The back face of the wafer(10) is grinded by performing wafer back grinding. The cover tape(12) is cut between the wafer ring(14) and the wafer(10). The cover tape(12) is removed from the wafer ring(14). A sawing tape(16) is adhered on the wafer(10) and the wafer ring(14). A cutting process for the sawing tape(16) of the outside of the wafer ring(14) is performed.