PAPER MATERIAL FOR USING AS CHIP-TYPE ELECTRONIC COMPONENT STORAGE MOUNT AND STORAGE MOUNT USING THE SAME

摘要

PURPOSE: A paper material for using as a chip-type electronic component storage mount has good peeling strength and is free from fluff even if a cover tape or a bottom tape is glued to the chip-type electronic component storage mount by heat-sealing with a high gluing speed. A storage mount using the same is provided. CONSTITUTION: An adhesive moderator having 6.5-14.0 of solubility parameter is distributed on at least one side of front and rear surfaces of the paper material. A distribution quantity of the adhesive moderator is 0.005-2.0g/m¬2.