发明名称 |
Method for controlling adhesive distribution in a flip-chip semiconductor product |
摘要 |
A method for controlling the adhesive distribution in a flip-chip semiconductor product has steps: (a) providing a substrate with a flip-chip electrically mounted on the substrate via multiple bumps, (b) providing an dam along an edge of the flip-chip, and (c) depositing adhesive on the dam to flow into a space between the substrate and a bottom of the flip-chip by capillary effect. The shape of the dam is determined by the density of the multiple bumps to control the flowing speed of the adhesive to obtain a good adhesive distribution.
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申请公布号 |
US6521481(B1) |
申请公布日期 |
2003.02.18 |
申请号 |
US20020041909 |
申请日期 |
2002.01.07 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN YU-WEN;CHOU HUI-LUNG;CHIEN WANN-LUNG |
分类号 |
H01L21/56;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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