| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a ball grid array(BGA) element 1, which enables its position relative to a circuit board after surface mounted to be a position prescribed before the surface mounting, and which simplifies the manufacturing of other elements that come into contact with the circuit board surface-mounted with the BGA element 1 and that prescribe an engaging length with the BGA element 1, and also to provide an optical communication module using the BGA element 1. SOLUTION: The BGA element 1 is equipped with a bottom face 10 having a BGA composed of a plurality of solder balls 11 and with an upper face 21 having a connector terminal constituted of more than one plug or receptacle, which is opposed to the bottom face 10 and which is individually in communication with each of the solder balls 11. In addition, the BGA element 1 is also equipped with a supporting part 14 that comes into contact with the mounted surface and prescribes the BGA element 1 when it is surface-mounted.</p> |
