| 发明名称 |
Composition for circuit board manufacture |
| 摘要 |
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer are disclosed. The composition includes hydrogen peroxide, inorganic acid, at least two corrosion inhibitors.
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| 申请公布号 |
US6521139(B1) |
申请公布日期 |
2003.02.18 |
| 申请号 |
US20000632736 |
申请日期 |
2000.08.04 |
| 申请人 |
SHIPLEY COMPANY L.L.C. |
发明人 |
KONDO MASAKI;MONTANO JOSEPH R. |
| 分类号 |
C23C22/05;C23C22/52;C23F1/18;C23F11/14;H05K3/38;H05K3/46;(IPC1-7):C23F1/00 |
主分类号 |
C23C22/05 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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