发明名称 |
Ball grid array package comprising a heat sink |
摘要 |
A semiconductor package comprises a semiconductor chip and a printed circuit board. The printed circuit board comprises a board body. An upper wiring layer is formed on the upper surface of the board body and includes a chip-mounting portion for mounting the semiconductor chip, board pads formed around the chip-mounting portion and electrically connected to said semiconductor chip, and an upper heat dissipation layer around said chip-mounting portion. Further, a lower wiring layer including a lower heat dissipation layer is formed on the lower surface of the board body. First heat-dissipating via holes are formed through the board body between the chip-mounting portion and the lower heat dissipation layer and are filled with a thermally conductive material for dissipating heat from the chip through the board body to the lower wiring layer. Second heat-dissipating via holes are formed through the board body below said upper heat dissipation layer and are filled with a thermally conductive material for dissipating heat generated from the chip through the board body to the upper heat dissipation layer.
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申请公布号 |
US6521990(B2) |
申请公布日期 |
2003.02.18 |
申请号 |
US20010995293 |
申请日期 |
2001.11.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
ROH KWON-YOUNG;KIM DONG-SUK |
分类号 |
H01L23/31;H01L23/36;H01L23/367;H01L23/498;H05K1/02;(IPC1-7):H01L23/10;H01L23/34 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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