| 摘要 |
An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. To use the above generic subassembly as the chip holding subassembly, an electrical components on the first face of the substrate include sockets which hold the chips that are tested. To use the above generic subassembly as the power converter subassembly, the electrical components on the first face of the substrate include electrical power converters for the chips that are tested.
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