发明名称 Multilayer printed circuit board having signal, power and ground through holes
摘要 A multilayer printed circuit board enables needless electro-magnetic radiation to be suppressed. Interlayer insulation materials are arranged in layer-built constitution between respective layers of a mixed wiring layer of a first signal and/or a power supply wiring, a first ground layer, a second ground layer, and a mixed wiring layer of a second signal and/or a power supply wiring. A through-hole for connecting the ground layers with each other is provided adjacently to a through-hole for connecting the signal and/or the power supply between these layers. According to the constitution, a return circuit current route of the signal and the power supply to the ground layers is secured. As a result, a loop made by the current becomes small, thus needless radiation of electro-magnetic wave is capable of being suppressed.
申请公布号 US6521843(B1) 申请公布日期 2003.02.18
申请号 US19990304631 申请日期 1999.05.04
申请人 NEC CORPORATION 发明人 KOHYA KENJI
分类号 H05K9/00;H05K1/00;H05K1/02;H05K1/11;H05K3/42;H05K3/46;(IPC1-7):H05K1/03 主分类号 H05K9/00
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