发明名称 |
Thermal transfer of microstructured layers |
摘要 |
Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the microstructured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
|
申请公布号 |
US6521324(B1) |
申请公布日期 |
2003.02.18 |
申请号 |
US19990451984 |
申请日期 |
1999.11.30 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
DEBE MARK K.;WOLK MARTIN B. |
分类号 |
B81C99/00;B41M3/00;B41M5/382;B41M5/385;B41M5/40;B41M5/42;B81C1/00;H01J7/24;H01J9/02;H01L21/48;H01L21/68;H05K3/04;(IPC1-7):B32B27/14 |
主分类号 |
B81C99/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|