发明名称 Thermal transfer of microstructured layers
摘要 Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the microstructured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
申请公布号 US6521324(B1) 申请公布日期 2003.02.18
申请号 US19990451984 申请日期 1999.11.30
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 DEBE MARK K.;WOLK MARTIN B.
分类号 B81C99/00;B41M3/00;B41M5/382;B41M5/385;B41M5/40;B41M5/42;B81C1/00;H01J7/24;H01J9/02;H01L21/48;H01L21/68;H05K3/04;(IPC1-7):B32B27/14 主分类号 B81C99/00
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