ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: An adhesive film for semiconductor, a lead frame and a semiconductor device using the same are provided to allow a semiconductor element to adhere to a lead frame at low temperatures with an excellent temperature cycle property. CONSTITUTION: An adhesive film(3) for semiconductor comprises a support film(1), adhesive layers(2) formed on both surfaces of the support film wherein each one of the adhesive layers comprises an adhesive having a glass transition temperature of 200 deg. C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 micro meter.