发明名称 |
LEAD FRAME AND FABRICATION METHOD THEREOF |
摘要 |
PURPOSE: A lead frame and fabrication method thereof are provided to improve the thermal and mechanical characteristics of the lead frame by using different alloy at the outer and inner part of the lead frame respectively. CONSTITUTION: A lead frame consists of two parts corresponding to a pad(21) and lead(22) respectively. The former part is made of nickel alloy and the latter is made of copper alloy as their different requirements such as thermal, mechanical and electrical characteristics. The nickel alloy has good characteristics about thermal expansion and oxidation so that exfoliation does not occur. A copper alloy has good characteristics in its electric conductivity and heat conduction so that high-speed signal can be transferred through it. |
申请公布号 |
KR20030013979(A) |
申请公布日期 |
2003.02.15 |
申请号 |
KR20010048284 |
申请日期 |
2001.08.10 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWON, GYEONG DO |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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