METHOD OF FABRICATING SEMICONDUCTOR FOR SMOOTH DICING PROCESS

摘要

PURPOSE: A method of fabricating a semiconductor for smooth dicing process is provided to reduce chipping, crack and metal burr by applying photo-etching process even on a dummy region to eliminate metal on the edge of a wafer. CONSTITUTION: A dicing process is applied to a whole surface of a wafer including a dummy region. When a photo-etching process is not performed on metal on the region, the area has different malleability and ductility so that it causes chipping, crack and metal burr. When the photo-etching process is done even on the dummy area, metal material is completely eliminated so that bad production caused by different malleability and ductility can be avoided.