摘要 |
PURPOSE: A mapping apparatus of semiconductor equipment is provided to prevent a defect due to an inserting error of a wafer into a slot of a cassette by using the first and the second wafer detection sensors. CONSTITUTION: The first and the second wafer detection sensors(122,124) are installed at a mapping portion. The first and the second wafer detection sensors(122,124) include a light emitting portion and a light receiving portion, respectively. A cassette(110) can be moved to an upper direction or a lower direction. A wafers is detected by irradiating the light(126) to the cassette(110). In addition, the mapping portion having the first and the second wafer detection sensors(122,124) can be moved to the upper direction or the lower direction in order to detect the wafer.
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