发明名称 |
PROCEDE DE FABRICATION DE DISPOSITIF ELECTRONIQUE PORTABLE A CIRCUIT INTEGRE PROTEGE PAR RESINE PHOTOSENSIBLE |
摘要 |
<p>In a method for producing a portable electronic device with an integrated circuit, a resin band is deposited around the chip of an integrated circuit and connection wires. The resin is highly viscous and can be polymerized with U.V. radiation. A low-viscosity filling resin which can be polymerized with U.V. radiation is deposited in the space defined by the resin band, and the protected resins are polymerized by exposure to U.V. radiation. The filling resin contains mechanically reinforcing fibers. The entire process can be carried out in a continuous manner.</p> |
申请公布号 |
FR2793069(B1) |
申请公布日期 |
2003.02.14 |
申请号 |
FR19990005394 |
申请日期 |
1999.04.28 |
申请人 |
GEMPLUS |
发明人 |
LAVIRON THIERRY;FOURNIER JEAN PIERRE;LERICHE CHRISTIAN |
分类号 |
G06K19/077;H01L21/44;H01L21/56;H01L23/24;H01L23/29 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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