| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of bubbles in solder with a simple structure. SOLUTION: A first member 13 where solder 12 is arranged on the surface to be die-bonded to, a base 14 where the first member 13 is placed on a predetermined position, a second member 15, which abuts on solder 12 arranged on the surface of the first member 13 to be die-bonded to and which is arranged so as to be inclined from the first member 13, and an incline decreasing means 16 for inclining and holding the second member 15 to the first member 13, the incline decreasing means 16 decreasing a tilt angle θ1 of the second member 15 from the first member 13 in the state that solder 12 is melted, are provided. In the state that the first and second members 13, 15 and solder 12 are heated and the solder 12 is melted, while the first incline decreasing means 16 gradually decreases the tilt angle θ1 of the second member 15 from the first member 13, die-bonding is performed. Thus, the occurrence of bubbles in the solder 12 can be restrained. |
