| 摘要 |
PROBLEM TO BE SOLVED: To make a semiconductor light emitting device thin without performing a drilling working operation to a wiring board. SOLUTION: The semiconductor light emitting device has a structure wherein the thickness of a holding substrate 3 is made thicker than the thickness of a submount element 2 on which a semiconductor light emitting element 1 is mounted, a recess 3b for submount-element housing whose size is equal to, or deeper than, the thickness of the submount element 2 is formed on the back of the holding substrate 3, and two electrodes 2a, 2b of the submount 2 are bonded to interconnections 3c, 3d of the holding substrate 3 in a state that the submount element 2 is housed in the recess 3b for submount-element housing. As a result, the semiconductor light emitting device can be made thin without performing the drilling working operation to the wiring board 5. |
