发明名称 METHOD OF FORMING CONDUCTIVE PART ON MOLDED GOODS
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing at low cost a molded goods having a sturdy conductive part that is hardly separated and does not have a problem of selection such as a molded goods having a metallic conductive part. SOLUTION: This is a forming method of a conductive part in which a cover material is contacted on the face of a part or whole face of the molded goods made of a thermoplastics composite or a thermosetting resin composite having a surface electrical resistance of 10 MΩ per 1 cm, and an electromagnetic wave is irradiated passing through the cover material and, by generating heat on the interface of the cover material and the molded goods, the resin at the exothermic part on the side of molded goods is denaturalized, and then, by removing the cover material, the denaturalized part becomes a conductive layer having a surface electrical resistance of 1 MΩ per 1 cm or less. The cover material is constructed of a substance that does not absorb or hardly absorbs the electromagnetic wave used.
申请公布号 JP2003045250(A) 申请公布日期 2003.02.14
申请号 JP20010225686 申请日期 2001.07.26
申请人 ASAHI KASEI CORP 发明人 KONDO MASAAKI
分类号 H01B13/00;(IPC1-7):H01B13/00 主分类号 H01B13/00
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