| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing noise appearing in a terminal formed on a semiconductor substrate. SOLUTION: The semiconductor device 10 includes a rectangular semiconductor substrate 11, constituent parts 12 formed on the semiconductor substrate 11, and various terminals including a power source terminal 20 and a ground terminal 22 formed in the neighborhood of the periphery of the semiconductor substrate 11. The constituent parts 12 include a bypass capacitor 14, one end of the bypass capacitor 14 is connected to the power source terminal 20, and the other end is connected to the ground terminal 22 respectively. In addition, an induction part 30 is provided in the outside of the semiconductor substrate 11, one end of the induction part 30 is connected to the power source terminal 20 and the other end is connected to a power source circuit 40 respectively. |
