| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module which has superior mounting reliability and productivity. SOLUTION: With a terminal electrode 12 of a semiconductor device 11 which is in a state of being aligned with an input/output terminal electrode of a circuit board 14, the semiconductor device 11 is placed on the circuit board 14. As a pretreatment and an post treatment of the process of placing the semiconductor device 11 on the circuit board 14, a photosensitive sealing region 20 is supplied, at least to an electrode connection section between the terminal electrode 2 and the input/output terminal electrode 15, except for a photodetectng region 17 of the semiconductor device and a through-hole 18 of the circuit board 14. The photosensitive sealing resin 20 is irradiated with a light beam to obtain semi-hardened surface. By relatively pressurizing the semiconductor device with respect to the circuit board 14, a salient electrode 13, formed in the input/output terminal electrode 15 is pressed, while being abutted against the input/output terminal electrode 15, and is deformed.</p> |
