| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is superior in dimensional accuracy and equipped with a wiring layer that is bonded to an insulating board with high strength after baking, has no problem about an external appearance such as a spread of plating, and is low in specific resistance. SOLUTION: A multilayer wiring board A is composed of an insulating board 10 of glass ceramic and a wiring layer 3 of high-purity metal conductor which contains 99.5 wt.% or above copper and is formed on the surface of the wiring board A and/or inside it, and a diffusion layer 8 containing at least one element out of Sn and Zn is formed as thick as 1 to 40μm on the surface of the wiring layer 3 coming into contact with the insulating board 10. |
