| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device, a method, and a reflow soldering device, where a part which is low in heat-resistant properties is prevented from being reduced in reliability. SOLUTION: A soldering device is equipped with an oscillation unit 110 and an impedance matching mechanism 120, ultrasonic vibrations are fed to a printed board 102 from the oscillation unit 110, and energy produced in the printed board 102 by the ultrasonic vibrations is restrained from flowing out of the printed board 102 by the impedance matching mechanism 120 and heats up only the printed board to melt solder. When solder is melted, this soldering device has a lower heat energy loss than usual, so that the device is capable of saving energy very much. When a part having low heat-resistant properties is soldered, the part itself is not heated, so that a thermal load imposed on it can be more reduced than usual, and a soldering operation never deteriorates the reliability of the part. |
