WIRING FORMING METHOD UTILIZING DUAL DAMASCENE

摘要

PROBLEM TO BE SOLVED: To provide the forming method of electric wiring minimizing damage of a lower conductive pattern. SOLUTION: A first prevention film 32, a second prevention film 36 and a third insulating film 38 are formed on a first insulating film 30. A capping film 40 is formed on the third insulating film 38. Prescribed parts of the capping film 40, the third insulating film 38 and a second insulating film 34 are etched to form a via hole 42. A polymer film 46 is formed on the exposed first prevention film 32. The remaining capping film 40 and third insulating film 38 are continuously etched to form a trench. The first prevention film 32 exposed on the bottom face of a photoresist pattern 44, the polymer film 46 and the via hole 42 is removed.