| 摘要 |
PURPOSE: Provided is a silicone wafer polishing agent composition, which is excellent in processability and uniform surface-flatness and prevents surface-scratches of a wafer to the utmost after processing and removes easily residual particles from the surface of the wafer after cleaning. CONSTITUTION: The silicone wafer polishing agent composition contains: 100pts.wt. of colloidal silica sol containing 10-50wt% of silica(SiO2) and having an average particle size of 10-150nm; 0.1-5pts.wt. of an alkylhalo silane as a silica-coagulation preventing agent, wherein the alkylhalo silane is at least one selected from trimethyl halo silane, triethyl halo silane, tripropyl halo silane, trimethyl chloro silane, and etc.; 0.01-5pts.wt. of a dispersing agent being a non-ionic surfactant and an anionic surfactant having hydrophilicity and hydrophobicity in the ratio of 12-20, wherein the weight ratio of the anionic surfactant and the non-ionic surfactant is 10:1-50:1; 0.1-10pts.wt. of at least one processability accelerator selected from alkyl amine, alkylene amine, and alkanol amine; 0.1-5pts.wt. of an organic acid; 0.1-5pts.wt. of a water-soluble salt. |
