摘要 |
PURPOSE: To provide an additive for an accelerator bath solution which contains one or more compounds for preventing the suspension of an accelerator bath solution with specified structure, and to provide the accelerator bath solution. CONSTITUTION: The additive for an accelerator bath solution contains one or more compounds for preventing the suspension of an accelerator bath solution with specified structure. The accelerator bath solution contains the above one or more compounds for preventing the suspension of an accelerator bath solution. In an accelerator treatment stage in an electroless copper plating method, the accelerator bath solution is used, so that the increase of the turbidity of the accelerator bath solution can be suppressed.
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