发明名称 ADDITIVE FOR ACCELERATOR BATH SOLUTION AND ACCELERATOR BATH SOLUTION
摘要 PURPOSE: To provide an additive for an accelerator bath solution which contains one or more compounds for preventing the suspension of an accelerator bath solution with specified structure, and to provide the accelerator bath solution. CONSTITUTION: The additive for an accelerator bath solution contains one or more compounds for preventing the suspension of an accelerator bath solution with specified structure. The accelerator bath solution contains the above one or more compounds for preventing the suspension of an accelerator bath solution. In an accelerator treatment stage in an electroless copper plating method, the accelerator bath solution is used, so that the increase of the turbidity of the accelerator bath solution can be suppressed.
申请公布号 KR20030013322(A) 申请公布日期 2003.02.14
申请号 KR20020045745 申请日期 2002.08.02
申请人 SHIPLEY COMPANY, LLC. 发明人 KANDA TAKASHI
分类号 C23C18/16;C23C18/28;C23C18/38;(IPC1-7):C23C18/38 主分类号 C23C18/16
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