| 摘要 |
PROBLEM TO BE SOLVED: To certainly connect the pad of a semiconductor chip with a lead on a substrate by stabilizing vibrations of a bonding tool even if the semiconductor chip is vacuum chucked. SOLUTION: A vibration transmission member comprises a first vibration transmission part having a length of d, whose center is at the position ofλ/2 in a travelling direction of ultrasonic vibrations, a second vibration transmission part, which has a length of (λ-d)/2 in the travelling direction and is coupled between the first vibration transmission part and the transducer, and a third vibration transmission part, which has a length of (λ-d)/2 in the travelling direction and is coupled with the other end of the first vibration transmission part. The first vibration transmission part is provided with a chucking part, a duct part and an evacuating part, the duct part is provided ion a center line in a longitudinal direction of the first vibration transmission part 1a, and the evacuating part 9 is provided at an approximately center location of the side surface in a longitudinal direction part of the first vibration transmission part 1a, and an evacuating balance part 6 having the same mass as the evacuating part is provided on the other side surface of the longitudinal direction part of the first vibration transmission part 1a.
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