| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent increase in TCR due to variation in resistance value caused by the diffusion of resistor components, when an insulating substrate consisting of glass ceramics and a resistor are sintered by simultaneous baking. SOLUTION: A wiring board comprises a insulating substrate 3, consisting of sintered glass ceramics, a wiring layer 2 and a resistor 1 formed within the inner part and/or on the surface thereof by simultaneous baking. The resistor consists of 40-70 wt.% tin oxide, 30-60 wt.% platinum, and added 1-4 wt.% manganese dioxide or molybdenum trioxide. Reaction and diffusion phenomena between the resistor constituent material and the glass ceramics can be suppressed, so that the resistance value of the resistor 3 is made stable, and the TCR value becomes smaller.</p> |
