MULTILAYER SUBSTRATE WITH VIA FOR BUILD-UP AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer substrate with a via for build-up which is excellent in interlayer electrical connection reliability of a fined hole and its manufacturing method. SOLUTION: A hole (4) is formed by laser (5) in a desired position of a substrate (1) wherein a copper layer (2) and an insulation resin layer (3) are laminated. Electric plating is carried out while generating eddy current circularly in copper plating solution inside the hole (4) by oscillating the substrate (1) as shown by an arrow (A) in copper plating bath. As a result, an electrodeposition layer in an inner wall part surface of the hole (4) is formed thicker than an electrodeposition layer in an insulation resin layer surface (3a).