WIRING BOARD AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and electronic equipment the lands of which can be connected by using wiring patterns having significantly broad widths as compared with the conventional example at the time of mounting the semiconductor integrated circuit of a CSP, and so on. SOLUTION: The lands 2 are formed so that the wiring patterns 14 and 15 may be connected by only using parts of the lands 2, and the patterns 14 and 15 may be formed symmetrically with respect to the lands 2.