| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem which is induced on the reliability of the hermetic seal of an electronic component package, as the package is progressively miniaturized and thinned, with the package being composed of an insulation base and a flat plate-like metal lid which defines a space with the base for hermetically housing an electronic component therein with glass seal. SOLUTION: The electronic component package is composed of an insulation base 1, having a recess on the upside for mounting an electronic component 3 and a flat plate-like metal lid 2 bonded to the upside of the base 1 via a glass seal 6, to define a space with the base 1 for hermetically housing the component 3. The lid 2 has an active metal solder layer 7 on its bonding surface with the glass seal 6, and the layer 7 contains at least one among titanium, zirconium and hafnium.
|
