WIRING STRUCTURE, METHOD FOR FORMING WIRING AND SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a wiring structure in which incomplete wiring is eliminated without increasing the interval of adjacent lines at a part where the surface of a first semiconductor substrate abuts on the side face of a second semiconductor substrate. SOLUTION: Wiring trenches 3 are formed on the surface 11 of a first semiconductor substrate 1 in correspondence with a specified wiring shape and a conductive path 4 is provided in the wiring trenches 3. A second semiconductor substrate 2 is bonded onto the surface 11 of the first semiconductor substrate 1 to cover a part of the conduction path 4.