发明名称 |
HEAT TREATMENT APPARATUS FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can cool a substrate quickly on a high temperature side. SOLUTION: A movable partition plate 52 is provided between a lower surface of a substrate W held in a heat treatment furnace and the lower furnace wall 44 of the heat treatment furnace. In order to cool the substrate after a heat treatment, the movable partition plate is brought close to the substrate to form a gas passage 88 between the upper surface of the partition plate, and the lower surface of the substrate and cooling gas is introduced into the gas passage through a gas supply pipe 56.
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申请公布号 |
JP2003045817(A) |
申请公布日期 |
2003.02.14 |
申请号 |
JP20010227978 |
申请日期 |
2001.07.27 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
SASAKI KIYOHIRO;KOBAYASHI TOSHIYUKI;TAKAHASHI MITSUKAZU |
分类号 |
H01L21/26;(IPC1-7):H01L21/26 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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