发明名称 HEAT TREATMENT APPARATUS FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can cool a substrate quickly on a high temperature side. SOLUTION: A movable partition plate 52 is provided between a lower surface of a substrate W held in a heat treatment furnace and the lower furnace wall 44 of the heat treatment furnace. In order to cool the substrate after a heat treatment, the movable partition plate is brought close to the substrate to form a gas passage 88 between the upper surface of the partition plate, and the lower surface of the substrate and cooling gas is introduced into the gas passage through a gas supply pipe 56.
申请公布号 JP2003045817(A) 申请公布日期 2003.02.14
申请号 JP20010227978 申请日期 2001.07.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SASAKI KIYOHIRO;KOBAYASHI TOSHIYUKI;TAKAHASHI MITSUKAZU
分类号 H01L21/26;(IPC1-7):H01L21/26 主分类号 H01L21/26
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