| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure where high thermal conductivity and high electrical conductivity are ensured and a bonding part withstands heat cycle, regarding a mounting structure, in which electrode connections are made through solder bonding in the mounting of a power semiconductor. SOLUTION: The mounting structure is provided with a power semiconductor chip 1, where electrodes 3, 3 are arranged on both surfaces, and planar conducting members 30, 31 which pinch the semiconductor chip 1 in a sandwich form. The conducting members 30, 31 are bonded to the electrodes 3, 2 which are arranged on both surfaces of the semiconductor chip via solder layers 22, 23. The one conducting members 31 of the conducting members serves as the metal base of the semiconductor chip 1, and the other conducting member 30 has a plate thickness structure equal to that of a conducting member which corresponds to the metal base. |
