发明名称 INTEGRATED CIRCUIT AND MOUNTING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To enable mounting of integrated circuits, which are assembled in packages which differ in the number of terminals and the size on the same printed wiring board. SOLUTION: On the same printed wiring board, mounting positions of a part of terminals of integrated circuits which are assembled in two kinds of packages are made common, and mounting positions of remaining terminals are connected with a printed wiring.
申请公布号 JP2003046060(A) 申请公布日期 2003.02.14
申请号 JP20010234541 申请日期 2001.08.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANAKA KEISUKE
分类号 H05K3/34;H01L23/12;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L25/10 主分类号 H05K3/34
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