| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink device whose heat-radiating properties for cooling a heat-radiating element, such as CPU, can be improved and which speedily diffuses heat for a wide range from an area directly above the heat- generating element. SOLUTION: The device is provided with a base plate 2, formed of a material having satisfactory thermal conductivity and in which a plurality of heat- radiating fins 3 are erected on the upper face and a heat lane radiator 7, where a plurality of heat-radiating fins 4 are fixed to a heat lane 1 storing heat transmission operation liquid in a flat pipe and which is fixed to the upper face of the base plate 2. The heat-radiating fins 4 on the side of the heat lane radiator 7 are arranged at pitches which are narrower than those of the heat- radiating fins 3 on the side of the base plate 22.
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