| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that connection reliability cannot be satisfied when the density and thickness of a multilayer interconnection board are reduced in the multilayer interconnection board where an insulating layer containing an organic material is laminated. SOLUTION: A multilayer interconnection board 4 is made of an organic material, laminates a plurality of insulating layers 1 where a wiring conductor 2 made of metal foil is provided on at least one of upper and lower surfaces, and electrically connects the wiring conductors 2 positioned at upper and lower sections while the insulating layer 1 is being sandwiched via a through conductor 3. In the insulating layer 1, a film layer 6 made of a polyphenylene eter-based organic matter is formed on the upper and lower surfaces of an liquid crystal polymer layer 5 where tensile strength is at least 100 MPa, and flexural strength is at least 120 MPa. Stress due to difference in a coefficient of thermal expansion in a temperature cycle test and that due to warpage in the multilayer interconnection board can be reduced, and disconnection due to the generation of cracks in a substrate is prevented. |
